Description
Semiconductor equipment market is largely driven by the additional tools required to migrate chip designs to leading-edge nodes. With capacity-driven capex slowing down, semiconductor equipment demand may be unaffected if chip-makers are moving more aggressively to the leading-edge nodes.
China will further accelerate its semiconductor roadmap and capacity-building progress:
China has been actively expanding its semiconductor-production capacity and manufacturing facilities. There has been no significant disruption to China’s semiconductor industry during the COVID-19 outbreak.
For example, Wuhan-based Yangtze Memory Technologies (YMTC) continued operations throughout the lock-down. China currently spends about $5bn on wafer-fab equipment and it can help to offset any potential capex cut from the large chipmakers if it believes its current progress justifies additional investment.
The semiconductor equipment industry’s revenue is highly sensitive to the type of chips that are driving demand. The level of semiconductor capex spent by chipmakers:
Semiconductor equipment players’ revenues are highly sensitive to the capex of chipmakers, such as foundry/logic players (Intel, Taiwan Semiconductor Manufacturing Company, Samsung LSI) and memory players (Micron, SK Hynix and Samsung).
General demand and types of chips required:
New semiconductor equipment is required more in making leading-edge chips and computationally intense applications, such as application processors, server chips and CPUs.
The demand for semiconductor equipment is largely driven by the additional tools required for chipmakers to migrate to leading-edge nodes. This is especially the case because ALD tools are required more in foundry and logic chip manufacturing processes. Foundry and logic players are, compared with memory manufacturers, more committed to their shrinkage roadmaps and are therefore more likely to invest in advanced tools, such as ALD.
This report describes the semiconductor equipment markets for 27 different sectors and profiles 49 leading equipment suppliers in the U.S., Europe, and Asia. Market shares for each company for each sector are presented.
TABLE OF CONTENTS
Global Semiconductor Equipment Market, Market Shares, Market Forecasts
Chapter 1 Introduction
Chapter 2 Semiconductor Industry Driving Forces
2.1. Introduction
2.2. Foundries
2.2.1. Foundry Capex Trends
2.2.2. Foundry Revenue Growth
2.2.3. Foundry Market Share
2.2.4. Revenue Growth by Foundry
2.2.5. Global Foundry Market Trend by Application
2.2.6. Global Foundry Market Trend by Customer Type
2.2.7. Global Foundry Market Trend by Device
2.2.8. Foundry Technology Linewidth Roadmap
2.2.9. Capacity trend by linewidth
2.2.10. Capacity ratio by region
2.3. DRAM
2.3.1. Present and Future Capacity of DRAM by Manufacturer
2.3.2. DRAM Revenue Demand Forecast By Application
2.3.3. DRAM Market Shares
2.3.4. DRAM Capex
2.4. NAND
2.4.1. NAND Revenue Demand Forecast By Applications
2.4.2. NAND Market Shares
2.4.3. 3D NAND Capacity
2.5. China
2.5.1. China’s Semiconductor Infrastructure
2.5.2. China’s Semiconductor Market
2.5.3. China’s IC Production
2.5.4. China’s IC Consumption
2.5.5. China’s IC Production/Consumption Ratio
2.5.6. China’s IC Import Requirements
2.5.7. China’s IC Supply/Demand
2.5.8. China’s IC Fab Capacity
2.5.9. China’s IC Fab Capacity by Region
2.5.10. China’s 8- And 12-Inch Fabs and Foundries
2.5.11. China’s IC Fab Capacity by Wafer Size
2.5.12. China’s IC Fab Capacity by Geometry
2.5.13. China’s IC Production by Type
Chapter 3 Market Business Sectors Shares and Forecast
3.1. AMHS Market Shares and Forecast
3.2. CMP Market Shares and Forecast
3.3. Clean Market Shares and Forecast
3.3.1. Plasma Strip
3.3.2. Spray Processors
3.3.3. Wet Stations
3.4. Deposition Market Shares and Forecast
3.4.1. ALD
3.4.2. Epitaxy
3.4.3. MOCVD
3.4.4. LPCVD (non-tube)
3.4.5. LPCVD (tube)
3.4.6. PECVD
3.4.7. PVD
3.5. Ion Implantation Market Shares and Forecast
3.5.1. High-Current
3.5.2. High-Energy
3.5.3. Medium-Current
3.6. Lithography Market Shares and Forecast
3.6.1. Direct-Write E-Beam Lithography
3.6.2. Mask-Making Lithography
3.6.3. Steppers
3.7. Oxidation/Diffusion Market Shares and Forecast
3.8. Photoresist Processing (Track) Market Shares and Forecast
3.9. RTP Market Shares and Forecast
3.10. Plasma Etch Market Shares and Forecast
3.10.1. Dielectric
3.10.2. Conductive
3.11. Process Control Market Shares and Forecast
3.11.1. Lithography Metrology
3.11.2. Thin-Film Metrology
3.11.3. Wafer Inspection and Defect Review
3.12. Wafer-Level Packaging Market Shares and Forecast
Chapter 4 U.S. Semiconductor Equipment Suppliers – Profiles
4.1. Applied Materials
4.1.1. Business Sectors Covered In The Market Analysis Chapter
4.1.2. Company Profile
4.1.3. Company Financials
4.2. Axcelis Technologies
4.1.2. Business Sectors Covered In The Market Analysis Chapter
4.2.2. Company Profile
4.2.3. Company Financials
4.3. KLA-Tencor
4.3.1. Business Sectors Covered In The Market Analysis Chapter
4.3.2. Company Profile
4.3.3. Company Financials
4.4. Lam Research
4.4.1. Business Sectors Covered In The Market Analysis Chapter
4.4.2. Company Profile
4.4.3. Company Financials
4.5. Nanometrics
4.5.1. Business Sectors Covered In The Market Analysis Chapter
4.5.2. Company Profile
4.5.3. Company Financials
4.6. Rudolph Technologies
4.6.1. Business Sectors Covered In The Market Analysis Chapter
4.6.2. Company Profile
4.6.3. Company Financials
4.7. Veeco
4.7.1. Business Sectors Covered In The Market Analysis Chapter
4.7.2. Company Profile
4.7.3. Company Financials
Chapter 5 European Semiconductor Equipment Suppliers – Profiles
5.1. Aixtron
5.1.1. Business Sectors Covered In The Market Analysis Chapter
5.1.2. Company Profile
5.1.3. Company Financials
5.2. ASM International
5.2.1. Business Sectors Covered In The Market Analysis Chapter
5.2.2. Company Profile
5.2.3. Company Financials
5.3. ASML
5.3.1. Business Sectors Covered In The Market Analysis Chapter
5.3.2. Company Profile
5.3.3. Company Financials
5.4. Carl Zeiss
5.4.1. Business Sectors Covered In The Market Analysis Chapter
5.4.2. Company Profile
5.4.3. Company Financials
5.5. Camtek
5.5.1. Business Sectors Covered In The Market Analysis Chapter
5.5.2. Company Profile
5.5.3. Company Financials
5.6. EV Group
5.6.1. Business Sectors Covered In The Market Analysis Chapter
5.6.2. Company Profile
5.6.3. Company Financials
5.7. LPE
5.7.1. Business Sectors Covered In The Market Analysis Chapter
5.7.2. Company Profile
5.7.3. Company Financials
5.8. Mycronic
5.8.1. Business Sectors Covered In The Market Analysis Chapter
5.8.2. Company Profile
5.8.3. Company Financials
5.9. Nova Measuring Instruments
5.9.1. Business Sectors Covered In The Market Analysis Chapter
5.9.2. Company Profile
5.9.3. Company Financials
5.10. Oerlikon / Evatec
5.10.1. Business Sectors Covered In The Market Analysis Chapter
5.10.2. Company Profile
5.10.3. Company Financials
5.11. Semilab
5.11.1. Business Sectors Covered In The Market Analysis Chapter
5.11.2. Company Profile
5.11.3. Company Financials
Chapter 6 Asian Semiconductor Equipment Suppliers – Profiles
6.1. Advantest
6.1.1. Business Sectors Covered In The Market Analysis Chapter
6.1.2. Company Profile
6.1.3. Company Financials
6.2. Canon
6.2.1. Business Sectors Covered In The Market Analysis Chapter
6.2.2. Company Profile
6.2.3. Company Financials
6.3. Canon Anelva
6.3.1. Business Sectors Covered In The Market Analysis Chapter
6.3.2. Company Profile
6.3.3. Company Financials
6.4. Daifuku
6.4.1. Business Sectors Covered In The Market Analysis Chapter
6.4.2. Company Profile
6.4.3. Company Financials
6.5. Ebara
6.5.1. Business Sectors Covered In The Market Analysis Chapter
6.5.2. Company Profile
6.5.3. Company Financials
6.6. Eugene Technology
6.6.1. Business Sectors Covered In The Market Analysis Chapter
6.6.2. Company Profile
6.6.3. Company Financials
6.7. Hitachi High-Technologies
6.7.1. Business Sectors Covered In The Market Analysis Chapter
6.7.2. Company Profile
6.7.3. Company Financials
6.8. Hitachi Kokusai Electric
6.8.1. Business Sectors Covered In The Market Analysis Chapter
6.8.2. Company Profile
6.8.3. Company Financials
6.9. JEOL
6.9.1. Business Sectors Covered In The Market Analysis Chapter
6.9.2. Company Profile
6.9.3. Company Financials
6.10. Jusung Engineering
6.10.1. Business Sectors Covered In The Market Analysis Chapter
6.10.2. Company Profile
6.10.3. Company Financials
6.11. KC Tech
6.11.1. Business Sectors Covered In The Market Analysis Chapter
6.11.2. Company Profile
6.11.3. Company Financials
6.12. Lasertec
6.12.1. Business Sectors Covered In The Market Analysis Chapter
6.12.2. Company Profile
6.12.3. Company Financials
6.13. Murata Machinery
6.13.1. Business Sectors Covered In The Market Analysis Chapter
6.13.2. Company Profile
6.13.3. Company Financials
6.14. Nikon
6.14.1. Business Sectors Covered In The Market Analysis Chapter
6.14.2. Company Profile
6.14.3. Company Financials
6.15. Nippon Sanso
6.15.1. Business Sectors Covered In The Market Analysis Chapter
6.15.2. Company Profile
6.15.3. Company Financials
6.16. Nissin Ion Equipment
6.16.1. Business Sectors Covered In The Market Analysis Chapter
6.16.2. Company Profile
6.16.3. Company Financials
6.17. NuFlare Technology
6.17.1. Business Sectors Covered In The Market Analysis Chapter
6.17.2. Company Profile
6.17.3. Company Financials
6.18. PSK
6.18.1. Business Sectors Covered In The Market Analysis Chapter
6.18.2. Company Profile
6.18.3. Company Financials
6.19. Screen Semiconductor Solutions
6.19.1. Business Sectors Covered In The Market Analysis Chapter
6.19.2. Company Profile
6.19.3. Company Financials
6.20. SEMES
6.20.1. Business Sectors Covered In The Market Analysis Chapter
6.20.2. Company Profile
6.20.3. Company Financials
6.21. SEN
6.21.1. Business Sectors Covered In The Market Analysis Chapter
6.21.2. Company Profile
6.21.3. Company Financials
6.22. TES
6.22.1. Business Sectors Covered In The Market Analysis Chapter
6.22.2. Company Profile
6.22.3. Company Financials
6.23. Tokyo Electron
6.23.1. Business Sectors Covered In The Market Analysis Chapter
6.23.2. Company Profile
6.23.3. Company Financials
6.24. Tokyo Seimitsu
6.24.1. Business Sectors Covered In The Market Analysis Chapter
6.24.2. Company Profile
6.24.3. Company Financials
6.25. Topcon Technohouse
6.25.1. Business Sectors Covered In The Market Analysis Chapter
6.25.2. Company Profile
6.25.3. Company Financials
6.26. Toray Engineering
6.26.1. Business Sectors Covered In The Market Analysis Chapter
6.26.2. Company Profile
6.26.3. Company Financials
6.27. Ulvac
6.27.1. Business Sectors Covered In The Market Analysis Chapter
6.27.2. Company Profile
6.27.3. Company Financials
6.28. Ushio
6.28.1. Business Sectors Covered In The Market Analysis Chapter
6.28.2. Company Profile
6.28.3. Company Financials
6.29. Wonik IPS
6.29.1. Business Sectors Covered In The Market Analysis Chapter
6.29.2. Company Profile
6.29.3. Company Financials
LIST OF TABLES
2.1. Foundry Capex ($ Billions) And Shares (%)
2.2. Foundry Forecast
2.3. Pure Play Foundry Revenue Shares
2.4. Global Foundry Market By Application
2.5. Global Foundry Market By Customer Type
2.6. Global Foundry Market By Device Type
2.7. Technology Roadmaps For China Foundries
2.8. Global Foundry Market By Linewidth
2.9. Foundry Capacity By Region
2.10. DRAM Wafer Capacity Forecast by Fab – Wafers
2.11. DRAM Bit Growth Demand Forecast by Application
2.12. DRAM Revenue Demand Forecast by Application
2.13. DRAM Market Shares
2.14. DRAM Capex Forecast by Company
2.15. NAND Wafer Capacity by Company Fab
2.16. NAND Bit Growth Supply Forecast by Company
2.17. NAND Bit Growth Demand Forecast by Application
2.18. NAND Market Shares
2.19. 3D NAND Wafer Capacity Forecast by Fab
2-20. Capex Forecast By Memory And Other Ic Manufacturers
2-21. China’s 8- And 12-Inch Fabs and Foundries
3.1. AMHS Market Forecast
3.2. CMP Market Forecast
3.3. Plasma Strip Market Forecast
3.4. Spray Processors Market Forecast
3.5. Wet Stations Market Forecast
3.6. ALD Market Forecast
3.7. Epitaxy Market Forecast
3.8. MOCVD Market Forecast
3.9. LPCVD (non-tube) Market Forecast
3.10. LPCVD (tube) Market Forecast
3.11. PECVD Market Forecast
3.12. PVD Market Forecast
3.13. High-Current Ion Implantation Market Forecast
3.14. High-Voltage Ion Implantation Market Forecast
3.15. Medium-Current Ion Implantation Market Forecast
3.16. Direct-Write E-Beam Lithography Market Forecast
3.17. Mask-Making Lithography Market Forecast
3.18. Steppers Market Forecast
3.19. Oxidation Market Forecast
3.20. Photoresist Processing (Track) Market Forecast
3.21. RTP Market Forecast
3.22. Dielectric Etch Market Forecast
3.23. Conductive Etch Market Forecast
3.24. Lithography Metrology Market Forecast
3.25. Thin-Film Metrology Market Forecast
3.26. Wafer Inspection and Defect Review Market Forecast
3.27. Wafer-Level Packaging Market Forecast
LIST OF FIGURES
2.1. China’s IC Production Forecast
2.2. China’s IC Consumption
2.3. China’s IC Production/Consumption Ratio
2.4. China’s IC Import Requirements
2.5. China’s IC Supply/Demand
2.6. China’s IC Fab Capacity
2.7. China’s IC Fab Capacity by Region
2.8. China’s IC Fab Capacity by Wafer Size
2.9. China’s IC Fab Capacity by Geometry
2.10. China’s IC Production by Type
3.1. AMHS Market Shares
3.2. CMP Market Shares
3.3. Plasma Strip Market Shares
3.4. Spray Processors Market Shares
3.5. Wet Stations Market Shares
3.6. ALD Market Shares
3.7. Epitaxy Market Shares
3.8. MOCVD Market Shares
3.9. LPCVD (non-tube) Market Shares
3.10. LPCVD (tube) Market Shares
3.11. PECVD Market Shares
3.12. PVD Market Shares
3.13. High-Current Ion Implantation Market Shares
3.14. High-Voltage Ion Implantation Market Shares
3.15. Medium-Current Ion Implantation Market Shares
3.16. Direct-Write E-Beam Lithography Market Shares
3.17. Mask-Making Lithography Market Shares
3.18. Steppers Market Shares
3.19. Oxidation Market Shares
3.20. Photoresist Processing (Track) Market Shares
3.21. RTP Market Shares
3.22. Dielectric Etch Market Shares
3.23. Conductive Etch Market Shares
3.24. Lithography Metrology Market Shares
3.25. Thin-Film Metrology Market Shares
3.26. Wafer Inspection and Defect Review Market Shares
3.27. Wafer-Level Packaging Market Shares
